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Fans, Thermal Management

Thermal - Heat Sinks

Datasheet Image M-Part Number Manufacturer Description Quantity Est. Market Price Min. Quantity Packaging Series Part Status Type Package Cooled Attachment Method Shape Length Width Diameter Height Off Base Heightof Fin Power Dissipation Temperature Rise Thermal Resistance Forced Air Flow Thermal Resistance Natural Material Material Finish
Product Image ATS-P1-138-C2-R0 Advanced Thermal Solutions Inc.

HEATSINK 25X25X15MM L-TAB T766

1 Minimum: 1 - pushPIN™ Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Square, Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.590" (15.00mm) - 12.18°C/W @ 100 LFM - Aluminum Blue Anodized
Product Image ATS-54150D-C1-R0 Advanced Thermal Solutions Inc.

HEAT SINK 15MM X 15MM X 9.5MM

1 Minimum: 1 - - Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Fins 0.591" (15.00mm) 0.591" (15.00mm) - 0.374" (9.50mm) - 26.20°C/W @ 200 LFM - Aluminum Black Anodized
Product Image ATS-52150B-C1-R0 Advanced Thermal Solutions Inc.

HEAT SINK 15MM X 15MM X 7.5MM

1 Minimum: 1 - maxiFLOW Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Angled Fins 0.591" (15.00mm) 0.591" (15.00mm) - 0.295" (7.50mm) - 19.70°C/W @ 200 LFM - Aluminum Blue Anodized
Product Image ATS-52150G-C1-R0 Advanced Thermal Solutions Inc.

HEAT SINK 15MM X 15MM X 12.5MM

1 Minimum: 1 - maxiFLOW Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Angled Fins 0.591" (15.00mm) 0.591" (15.00mm) - 0.492" (12.50mm) - 11.70°C/W @ 200 LFM - Aluminum Blue Anodized
Product Image 217-36CTE6 Wakefield-Vette

HEATSINK DPAK SMT TIN PLATED

1 Minimum: 1 - 217 Active Top Mount D²Pak (TO-263), SOL-20, SOT-223, TO-220 SMD Pad Rectangular, Fins 0.740" (18.80mm) 0.600" (15.24mm) - 0.360" (9.14mm) 1.0W @ 55°C 16.00°C/W @ 200 LFM 55.00°C/W Copper Tin
Product Image 507302B00000G Aavid, Thermal Division of Boyd Corporation

HEATSINK TO-220 2.5W LOW PROFILE

1 Minimum: 1 - - Active Board Level TO-220 Bolt On Square, Fins 0.750" (19.05mm) 0.750" (19.05mm) - 0.380" (9.65mm) 2.5W @ 60°C 10.00°C/W @ 200 LFM 24.00°C/W Aluminum Black Anodized
Product Image 7173DG Aavid, Thermal Division of Boyd Corporation

BOARD LEVEL HEATSINK .375"TO-220

1 Minimum: 1 - - Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 0.750" (19.05mm) 0.750" (19.05mm) - 0.375" (9.52mm) 1.5W @ 50°C 10.00°C/W @ 200 LFM 25.80°C/W Copper Tin
Product Image V-1100-SMD/B Assmann WSW Components

HEAT SINK COPPER DPAK TO-252

400 Minimum: 400 Tape & Reel (TR) Alternate Packaging - Active Top Mount TO-252 (DPak) SMD Pad Rectangular, Fins 0.320" (8.13mm) 0.790" (20.07mm) - 0.390" (9.91mm) - - 25.00°C/W Copper Tin
Product Image V-1100-SMD/B Assmann WSW Components

HEAT SINK COPPER DPAK TO-252

1 Minimum: 1 Cut Tape (CT) Alternate Packaging - Active Top Mount TO-252 (DPak) SMD Pad Rectangular, Fins 0.320" (8.13mm) 0.790" (20.07mm) - 0.390" (9.91mm) - - 25.00°C/W Copper Tin
Product Image V-1100-SMD/B Assmann WSW Components

HEAT SINK COPPER DPAK TO-252

- 1 Minimum: 1 Reel Alternate Packaging - Active Top Mount TO-252 (DPak) SMD Pad Rectangular, Fins 0.320" (8.13mm) 0.790" (20.07mm) - 0.390" (9.91mm) - - 25.00°C/W Copper Tin