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Integrated Circuits (ICs)

Clock/Timing - Application Specific

Datasheet Image M-Part Number Manufacturer Description Quantity Est. Market Price Min. Quantity Packaging Series Part Status PLL Main Purpose Input Output Numberof Circuits Ratio Input:Output Differential Input:Output Frequency Max Voltage Supply Operating Temperature Mounting Type Package Case Supplier Device Package
Product Image SI53102-A2-GMR Silicon Labs

IC CLK BUFFER PCIE 1:2 8TDFN

1 Minimum: 1 Cut Tape (CT) Alternate Packaging - Active No PCI Express (PCIe) Clock Clock 1 1:2 Yes/Yes 100MHz 2.25V ~ 3.63V -40°C ~ 85°C Surface Mount 8-WFDFN Exposed Pad 8-TDFN (1.4x1.6)
Product Image SI53102-A2-GMR Silicon Labs

IC CLK BUFFER PCIE 1:2 8TDFN

- 1 Minimum: 1 Reel Alternate Packaging - Active No PCI Express (PCIe) Clock Clock 1 1:2 Yes/Yes 100MHz 2.25V ~ 3.63V -40°C ~ 85°C Surface Mount 8-TDFN Exposed Pad 8-TDFN (1.4x1.6)
Product Image 9DBL411BGLFT IDT, Integrated Device Technology Inc

IC FAN/BUFFER DIFF 20TSSOP

3 000 Minimum: 3 000 Tape & Reel (TR) Alternate Packaging - Active No Intel QPI, PCI Express (PCIe) HCSL LP-HCSL 1 1:4 Yes/Yes 150MHz 3V ~ 3.6V 0°C ~ 70°C Surface Mount 20-TSSOP (0.173", 4.40mm Width) 20-TSSOP
Product Image 9DBL411BGLFT IDT, Integrated Device Technology Inc

IC FAN/BUFFER DIFF 20TSSOP

1 Minimum: 1 Cut Tape (CT) Alternate Packaging - Active No Intel QPI, PCI Express (PCIe) HCSL LP-HCSL 1 1:4 Yes/Yes 150MHz 3V ~ 3.6V 0°C ~ 70°C Surface Mount 20-TSSOP (0.173", 4.40mm Width) 20-TSSOP
Product Image 9DBL411BGLFT IDT, Integrated Device Technology Inc

IC FAN/BUFFER DIFF 20TSSOP

- 1 Minimum: 1 Reel Alternate Packaging - Active No Intel QPI, PCI Express (PCIe) HCSL LP-HCSL 1 1:4 Yes/Yes 150MHz 3V ~ 3.6V 0°C ~ 70°C Surface Mount 20-TSSOP (0.173", 4.40mm Width) 20-TSSOP
Product Image SI53152-A01AGM Silicon Labs

IC PCIE BUFFER 100MHZ 1IN 2OUT

1 Minimum: 1 Tray Alternate Packaging - Active No PCI Express (PCIe) Clock, Crystal HCSL 1 1:2 No/Yes 100MHz 3.135V ~ 3.465V -40°C ~ 85°C Surface Mount 24-WFQFN Exposed Pad 24-QFN (4x4)
Product Image 9DB403DGILFT IDT, Integrated Device Technology Inc

IC BUFFER 4OUTPUT DIFF 28-TSSOP

2 000 Minimum: 2 000 Tape & Reel (TR) Alternate Packaging - Active Yes PCI Express (PCIe) HCSL HCSL, LVDS 1 1:4 Yes/Yes 400MHz 3.135V ~ 3.465V -40°C ~ 85°C Surface Mount 28-TSSOP (0.173", 4.40mm Width) 28-TSSOP
Product Image 9DB403DGILFT IDT, Integrated Device Technology Inc

IC BUFFER 4OUTPUT DIFF 28-TSSOP

1 Minimum: 1 Cut Tape (CT) Alternate Packaging - Active Yes PCI Express (PCIe) HCSL HCSL, LVDS 1 1:4 Yes/Yes 400MHz 3.135V ~ 3.465V -40°C ~ 85°C Surface Mount 28-TSSOP (0.173", 4.40mm Width) 28-TSSOP
Product Image 9DB403DGILFT IDT, Integrated Device Technology Inc

IC BUFFER 4OUTPUT DIFF 28-TSSOP

- 1 Minimum: 1 Reel Alternate Packaging - Active Yes PCI Express (PCIe) HCSL HCSL, LVDS 1 1:4 Yes/Yes 400MHz 3.135V ~ 3.465V -40°C ~ 85°C Surface Mount 28-TSSOP (0.173", 4.40mm Width) 28-TSSOP
Product Image 9DB433AGLFT IDT, Integrated Device Technology Inc

IC CLK FANOUT/BUFF ZD 28TSSOP

2 000 Minimum: 2 000 Tape & Reel (TR) Alternate Packaging - Active Yes PCI Express (PCIe) Clock HCSL 1 1:4 Yes/Yes 166MHz 3.135V ~ 3.465V 0°C ~ 70°C Surface Mount 28-TSSOP (0.173", 4.40mm Width) 28-TSSOP